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    Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper

    Year: 2020

    Journal: ACS Appl. Mater. Interfaces, Volume 12, OCT 21, page 48027–48039

    Authors: Kadumudi, Firoz Babu; Trifol, Jon; Jahanshahi, Mohammadjavad; Zsurzsan, Tiberiu-Gabriel; Mehrali, Mehdi; Zeqiraj, Eva; Shaki, Hossein; Alehosseini, Morteza; Gundlach, Carsten; Li, Qiang; Dong, Mingdong; Akbari, Mohsen; Knott, Arnold; Almdal, Kristoffer; Dolatshahi-Pirouz, Alireza

    Organizations: Danish Council for Independent Research (Technology and Production Sciences)Det Frie Forskningsrad (DFF) [8105-00003B]; Villum Foundation [10103]; Netherlands Organization for Scientific Research (NWO)Netherlands Organization for Scientific Research (NWO) [R0004387]; Canadian Institutes for Health Research (CIHR)Canadian Institutes of Health Research (CIHR)

    Keywords: nanocellulose; origami electronics; green electronics; flexible electronics; nanosilicate; circular economy

    Today's consumer electronics are made from nonrenewable and toxic components. They are also rigid, bulky, and manufactured in an energy-inefficient manner via CO2-generating routes. Though petroleum-based polymers such as polyethylene terephthalate and polyethylene naphthalate can address the rigidity issue, they have a large carbon footprint and generate harmful waste. Scalable routes for manufacturing electronics that are both flexible and ecofriendly (Fleco) could address the challenges in the field. Ideally, such substrates must incorporate into electronics without compromising device performance. In this work, we demonstrate that a new type of wood-based [nanocellulose (NC)] material made via nanosilicate (NS) reinforcement can yield flexible electronics that can bend and roll without loss of electrical function. Specifically, the NSs interact electrostatically with NC to reinforce thermal and mechanical properties. For instance, films containing 34 wt % of NS displayed an increased young's modulus (1.5 times), thermal stability (290 -> 310 degrees C), and a low coefficient of thermal expansion (40 ppm/K). These films can also easily be separated and renewed into new devices through simple and low-energy processes. Moreover, we used very cheap and environmentally friendly NC from American Value Added Pulping (AVAP) technology, American Process, and therefore, the manufacturing cost of our NS-reinforced NC paper is much cheaper ($0.016 per dm(-2)) than that of conventional NC-based substrates. Looking forward, the methodology highlighted herein is highly attractive as it can unlock the secrets of Fleco electronics and transform otherwise bulky, rigid, and "difficult-to-process" rigid circuits into more aesthetic and flexible ones while simultaneously bringing relief to an already-overburdened ecosystem.
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