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This blog post discusses the importance of adhesion in the lithography process and how to predict adhesion with contact angle measurements.
HMDS is used to render the surface of silicon more hydrophobic and thus to match better with the chemistry of the photoresist.
QSense QCM-D technology enables analysis of cleaning process dynamics, surface etching, and surface residual
This blog post explains the concept of RCA cleaning and it's relation to contact angle.
Read about how and the QCM fundamental frequency matters in measurements
Contact angle measurements can be used to evaluate the cleanliness of silicon wafers.
QCM-D was used to compare the potency and mechanisms of action of two different detergents in disrupting lipid membranes
Attension Theta Wafer offers an optical tensiometer for fully automated mapping of up to 12-inch wafers.
Explore a case example of surfactant adsorption with QSense Omni, showcasing its performance and enhanced data quality.
