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    Revisiting Wetting, Freezing, and Evaporation Mechanisms of Water on Copper

    Year: 2021

    Journal: ACS Appl. Mater. Interfaces, Volume 13, AUG 11, page 37893–37903

    Authors: Korczeniewski, Emil; Bryk, Pawel; Koter, Stanislaw; Kowalczyk, Piotr; Kujawski, Wojciech; Kujawa, Joanna; Terzyk, Artur P.

    Organizations: Polish NCN [OPUS 13 UMO-2017/25/B/ST5/00975]

    Keywords: contact angle; wetting; copper; freezing; evaporation; molecular dynamics

    Wetting of metal surfaces plays an important role in fuel cells, corrosion science, and heat-transfer devices. It has been recently stipulated that Cu surface is hydrophobic. In order to address this issue we use high purity (1 1 1) Cu prepared without oxygen, and resistant to oxidation. Using the modern Fringe Projection Phase-Shifting method of surface roughness determination, together with a new cell allowing the vacuum and thermal desorption of samples, we define the relation between the copper surface roughness and water contact angle (WCA). Next by a simple extrapolation, we determine the WCA for the perfectly smooth copper surface (WCA = 34 degrees). Additionally, the kinetics of airborne hydrocarbons adsorption on copper was measured. It is shown for the first time that the presence of surface hydrocarbons strongly affects not only WCA, but also water droplet evaporation and the temperature of water droplet freezing. The different behavior and features of the surfaces were observed once the atmosphere of the experiment was changed from argon to air. The evaporation results are well described by the theoretical framework proposed by Semenov, and the freezing process by the dynamic growth angle model.
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