Interfacial interactions are key parameters in many processes in electronic industry such as in chemical mechanical polishing, adhesion of thin films and coatings as well as cleanliness of the electronic materials and components. Biolin Scientific offers tools in understanding and optimizing these processes which are crucial for ensuring reliability and performance of electronic devices.

Application areas

Cleanliness
Cleaning efficiency
Adhesion of thin films
CMP slurry additive and abrasive - surface interaction
Analysis of residue removal
Analysis of etching dynamics

Why choose Biolin Scientific?

Biolin Scientific offers tools to analyze different aspects of surface cleanliness to ensure reliable operation of the electronic components. Our instruments enable both quick check of the surface quality as well as more in-depth analysis of the cleaning process. With contact angle measurements, surface hydrophilicity and -phobicity can be quickly measured to evaluate the cleanliness of the surface. QCM-D technology offers a tool to study CMP slurry additive and surface interactions more in detailed to finetune the slurry mixtures used. It also allows fors analysis of removal rates as well as amount of residuals after cleaning.

Contact angle measurement of HMDS treated silicon

Cleanliness of wafers and other electronic components

Contact angle measurements with optical tensiometer offer a quantitative method for assessing the cleanliness of silicon wafers and other electronic components. Water contact angle offers quick and non-destructive method to check the surface cleanliness.

Adhesion between conformal coating and PCB board

Adhesion failure is one of the most common problems to cause quality issues in electronic components. The ensure proper adhesion between the PCB board and the conformal coating, the surface properties of the PCB need to be optimized. Contact angle measurements are used to evaluate the properties of the surfaces prior coating and bonding.

CMP analysis additive surface interaction

Analyze post CMP-cleaning and residue removal

Contamination control and surface cleanliness are crucial for successful silicon processing. QCM-D enables the analysis of contaminant adsorption and desorption under various conditions, and it allows for the assessment of post-CMP cleaner efficiency.

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Using QSense to assess cleaning efficiency

Assess and optimize cleaning efficiency

QCM-D technology offers time-resolved, nanoscale analysis of cleaning process dynamics, surface etching, and surface residual. This makes it a powerful tool for development and application of cleaning products and protocols in many industrial settings.

Analyze CMP slurry additive and abrasive interaction with surfaces

Understanding surface-molecule interactions is key to optimizing slurry performance and developing efficient CMP protocols. In this study, QCM-D was used to characterize the surface interaction of a specific abrasive, and the effects of different additives on this interaction were assessed.

Case study