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Low-temperature growth of multiple-stack high-density ZnO nanoflowers/nanorods on plastic substrates

Year: 2012

Journal: Nanotechnology, 2012, 23 (48) 485606, 20130115

Authors: Do Yeob Kim, Jae Young Kim, Hyuk Chang, Min Su Kim, Jae-Young Leem, John Ballato, Sung-O Kim

Organizations: Holcombe Department of Electrical and Computer Engineering, Center for Optical Materials Science and Engineering Technologies (COMSET), Clemson University, Clemson, SC 29634, USA, Samsung Advanced Institute of Technology, Samsung Electronics, Yongin 446-712, Korea, Department of Nano Systems Engineering, Center for Nano Manufacturing, Inje University, Gimhae 621-749, Korea , School of Materials Science and Engineering, Center for Optical Materials Science and Engineering Technologies (COMSET), Clemson University, Clemson, SC 29634, USA

Reported here is the low-temperature growth of multiple-stack high-density ZnO nanoflower/nanorod structures on polyethylene naphthalate (PEN) substrates derived from the surface modification of ZnO seed layers using an atmospheric-pressure plasma jet (APPJ) treatment. The plasma treatment could provide several advantages to the growth of multiple-stack ZnO nanoflower/nanorod structures: (i) the surface wettability of the seed layers changes from hydrophobic to hydrophilic, resulting in higher surface energies for the growth of high-density ZnO nanoflowers, (ii) the nucleation sites increase due to the increased surface roughness caused by the plasma etching, and (iii) there is no thermal damage to the plastic substrate from the plasma treatment due to its low-temperature weakly ionized discharge. It was also confirmed that multiple stacks of ZnO nanoflowers were obtained without degradation of the crystal quality or modification to the crystal shape or phase. The ZnO nanoflower/nanorod structures grew by lengths up to 4 μm due to an increased surface roughness of 10% and surface energy 5.5 times that of the seed layers. As shown, the APPJ is a very good method to obtain high-density ZnO nanostructures on plastic substrates below 150 °C, as is critical for flexible electronics.