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    Nano/micro-scale surface modifications using copper oxidation for enhancement of surface wetting and falling-film heat transfer

    Year: 2013

    Journal: International Journal of Heat and Mass Transfer, 2013, 62, pp 794-804, 20130926

    Authors: Batikan Köroglu, Kee Sung Lee, Chanwoo Park

    Organizations: Department of Mechanical Engineering, University of Nevada, 1664 N. Virginia Street, Reno, NV 89557-0312, USA; Research Scholar, School of Mechanical Systems Engineering, Kookmin University, Seoul 136-702, Republic of Korea

    The copper oxidation in NaOH aqueous solutions by a chemical immersion method was used to create nano/micro-scale surface morphology on heat transfer surfaces and control their liquid wettability. Different oxidation conditions, depending on nano/micro-scale surface morphologies, created hydrophilic surfaces (contact angle < 90°) with nano-whisker structures of CuO, and hydrophobic surfaces (contact angle > 90°) with nano/micro-crystal structures of Cu2O. A heat transfer experiment using a horizontal-tube, falling-film evaporator was performed to study the effect of the nano/micro-scale surface morphology of the evaporator tubes on surface wetting and heat transfer. The surface wetting and heat transfer performance of three different evaporators of plain (untreated), oxidized, and porous-layer coated tubes were compared.