Year: 2023
Journal: Communications Chemistry, Volume 6, 16/12/2023
Authors: Prasoon, Anupam; Yang, Hyejung; Hambsch, Mike; Nguyen, Nguyen Ngan; Chung, Sein; Müller, Alina; Wang, Zhiyong; Lan, Tianshu; Fontaine, Philippe; Kühne, Thomas D.; Cho, Kilwon; Nia, Ali Shaygan; Mannsfeld, Stefan C. B.; Dong, Renhao; Feng, Xinliang
Keywords: Surface assembly; Electronic materials