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    Solution deposition of Pt contacts suited to proton-conducting ceramics

    Year: 2019

    Journal: Solid State Ion., Volume 339, OCT 15

    Authors: Makagon, Evgeniy; Wachtel, Ellen; Merkle, Rotraut; Lubomirsky, Igor

    Organizations: German-Israeli Foundation for Scientific Research and DevelopmentGerman-Israeli Foundation for Scientific Research and Development [1-1342-302.5/2016]

    We have developed a simple method for depositing high quality platinum (Pt) metal contacts without the necessity of placing the substrate in vacuum or heating it above 180 degrees C. This method is particularly beneficial for hydrated oxide ceramics, as it prevents water loss and subsequent conductivity degradation. A mixture of two organic solvents was used: ethylene glycol monoethyl ether (EEE) and acetone. By dispersing the precursor PtCl4 in this mixed non-volatile/volatile solvent, homogeneous drying patterns were achieved. EEE was used as the reducing agent, providing a relatively slow rate of Pt deposition, and thereby avoiding formation and subsequent coagulation of Pt clusters. Drop casting of the solution (25 mu L/cm(2)) on mirror-polished surfaces was performed at 25 degrees C followed by 5 min partial solvent evaporation. The substrate was then heated to 180 degrees C for similar to 30 s, resulting in the formation of a metallic Pt layer. The method was successfully tested on 5 mol % Y doped BaZrO3 and 10 mol% Gd doped ceria ceramic pellets, alumina plates, and Kapton (R) polymer sheets. The in-plane sheet resistance was 30-110 Omega at room temperature after a single deposition cycle. Because of its versatility and low cost per deposition, the proposed method is very promising for a variety of substrates where high quality electrical contacts prepared at low temperature are required.
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