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    Stencil Printing of Liquid Metal upon Electrospun Nanofibers Enables High-Performance Flexible Electronics

    Year: 2021

    Journal: ACS Nano, Volume 15, DEC 28, page 19364–19376

    Authors: Wang, Meng; Ma, Chao; Uzabakiriho, Pierre Claver; Chen, Xi; Chen, Zhongrong; Cheng, Yue; Wang, Zirui; Zhao, Gang

    Organizations: National Key R&D Program of China [2018YFE0194500]; USTC Research Funds of the Double First-Class Initiative [YD2380002001]

    Keywords: stencil printing; electrospun nanofibers; liquid metal; flexible electronics; multilayer circuit

    Flexible electronics as an emerging technology has demonstrated potential for applications in various fields. With the advent of the Internet of Things era, countless flexible electronic systems need to be developed and deployed. However, materials and fabrication technologies are the key factors restricting the development and commercialization of flexible electronics. Here we report a simple, fast, and green flexible electronics preparation technology. The stencil printing method is adopted to pattern liquid metal on the thermoplastic polyurethane membrane prepared by electrospinning. Besides, with layer-by-layer assembly, flexible circuits, resistors, capacitors, inductors, and their composite devices can be prepared parametrically. Furthermore, these devices have good stretchability, air permeability, and stability, while they are multilayered and reconfigurable. As proof, this strategy is used to fabricate flexible displays, flexible sensors, and flexible filters. Finally, flexible electronic devices are also recycled and reconfigured.
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