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This blog post discusses the importance of adhesion in the lithography process and how to predict adhesion with contact angle measurements.
HMDS is used to render the surface of silicon more hydrophobic and thus to match better with the chemistry of the photoresist.
This blog post explains the concept of RCA cleaning and it's relation to contact angle.
Contact angle measurements can be used to evaluate the cleanliness of silicon wafers.
Attension Theta Wafer offers an optical tensiometer for fully automated mapping of up to 12-inch wafers.
Standard contact angle measurement considers the surface's chemical properties. The influence of surface roughness is added by utilizing the Wenzel equation.
Fiber contact angles can be measured with several different methods
Characterization of superhydrophilic surfaces is commonly done with contact angle measurements.
Contact angle provides insights into the wettability and adhesion properties of cosmetic ingredients and formulations.
